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Prof. Dr.-Ing. Andrey Prihodovsky

Centre for Applied Research

TC Parsberg/Lupburg

Academic Director

Academic Director Technology Campus Parsberg-Lupburg

1.15

09492/8384-103

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Zeitschriftenartikel

  • Korbinian Schröcker
  • Maximilian Fichtl
  • B. Bax
  • D. Scheider
  • M. Reisacher
  • Andrey Prihodovsky

Mechanical properties of the LMD-processed material Ferro55 in as-built and heat-treated conditions

In: Procedia CIRP vol. 111 pg. 228-232.

  • (2022)

DOI: 10.1016/j.procir.2022.08.055

The die and mould industry shows a growing interest in the DED family of the additive manufacturing processes. DED processes like LMD are used in manufacturing of moulds with improved functionality and in repair processes. The metallic materials used for LMD processing of the mould components should exhibit good weldability and possess high mechanical properties such as hardness and strength. The properties of LMD samples made out of the Ferro55 material, specially developed for the deposition processes, were investigated intensively. The mechanical properties were measured in as-built, hardened, and tempered samples. The hardness distribution and the variation of the chemical compositions were examined as well. Ferro55 material shows a very high strength and hardness already in as-built condition. These properties exceed the properties of comparable hot forming tool steels like X37CrMoV5-1 (1.2343). Further improvements are achieved through the subsequent heat treatment.
  • TC Parsberg/Lupburg
  • NACHHALTIG
Vortrag

  • T. Heberholz
  • Andrey Prihodovsky
  • M. Nowottnick

Einfluss eines abnormalen (CuNi)6Sn5/(NiCu)3Sn4-Schichtwachstums auf die Robustheit von bleifreien Zinn-Silber-Basis-Lotstellen bei Temperaturen oberhalb von 175 °C

In: Fachtagung/Konferenz EBL 2020 - Elektronische Baugruppen und Leiterplatten

Fellbach

  • 18.-19.02.2020 (2020)
  • Extern
  • DIGITAL
  • NACHHALTIG
Beitrag in Sammelwerk/Tagungsband

  • T. Heberholz
  • Andrey Prihodovsky
  • M. Nowottnick

Influence of a New Abnormal (CuNi)6Sn5 / (NiCu)3Sn4 Layer Growth at Temperatures Above 175°C in Tin Silver Based Lead-Free Solder Joints

  • (2019)
  • Extern
  • DIGITAL
  • NACHHALTIG
Vortrag

  • Anton Schmailzl
  • Korbinian Schröcker
  • Ludwig Gansauge
  • Andrey Prihodovsky

Potenziale von hybriden Fertigungsprozessketten

In: 1. TRIOKON 2019 – Die ostbayerische Transferkonferenz für Wirtschaft, Wissenschaft und Gesellschaft

Regensburg

  • 27.09.2019 (2019)
  • TC Parsberg/Lupburg
  • DIGITAL